Advancing Chiplet
Interconnectivity
Customizable Standards Based Die-to-Die Interconnect Solutions
Open Standards Support
Blue Cheetah provides the most area and power-efficient, performant chiplet interconnect IP solutions customized to any individual chiplet’s needs. Its BlueLynx™ IP provides physical (PHY) and optional link layer chiplet interfaces for advanced and standard packaging applications, with support for both Open Compute Project (OCP), Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe). BlueLynx connects to on-die buses/Networks-on-Chip (NoCs) with various standards, including AMBA®,AXI4, AXI5 Lite, ACE, and CHI.
Features & Benefits
Customization
Die-to-die solutions are rapidly tailored to your unique needs. Choose your packaging type, data rate, I/O configuration, process and more.
State of the Art PPA
Our architects and engineers enable uncompromised design realization.
Faster Time to Market
Our executable generator technology reduces product development and iteration time with implementation-ready results.
Risk Reduction
Compiler like development process produces industry standard design collateral that is predictable and silicon-integration ready.
Custom-Optimized for AI, High Performance Computing, and Mobile Markets
- Standards-based supporting UCle and BoW
- Industry-leading PPA and bandwidth density with 40+ Gbps/line and 15+ Tbps/mm
- 2D, advanced 2.5D and 3D packaging applications
- Available in 7 nodes across three foundries
Join Our Team
At Blue Cheetah, you will work with some of the world’s most talented engineers and leaders to shape the future of chiplets.
Get in Touch
Our team would love to hear from you. We are always available to answer any questions you should have.